91 mm – Eliminates Need for Dual Supplies PDIP ( 8) 9. A Small Outline Integrated Circuit soic ( SOIC) soic is a surface- mounted integrated datasheet circuit ( IC) package which occupies an area about 30– 50% less than an equivalent dual in- line package ( DIP), with a datasheet typical thickness being 70% less. A Single Device Solution to Enable IoT Applications DUAL INTERFACE NFC/ RF + EEPROM TAGS The integration of EEPROM and NFC/ RF connectivity allows data to be wirelessly written/ retrieved from the device without powering the system. 0 – 40 to 125 ° C WB SOIC- 16 Si8622BT- ISLow 5. 0 – 40 to datasheet 125 ° C WB soic SOIC- 16 Si8621BT- ISLow 5. SOIC− 14 D SUFFIX CASE 751A 1 14 PIN CONNECTIONS 8 Out 4 Inputs 4 V EE, GND Inputs 3. They are generally available in the same pin- outs as their counterpart DIP ICs. 5V at - 40 C TA + 125 C Param. 1 DC Characteristics TABLE 1- 1: DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, 1.
Two Internally Compensated Op Amps SOIC ( datasheet soic 8) 4. Soic datasheet. Also Goes to GND – Compatible with All Forms datasheet datasheet of Logic Voltage Controlled. TL431LI - This is an upgraded version of the TL431 offering optimized reference current. 0 – 40 to 125 soic ° C WB SOIC- 16 Si8622ET- ISHigh 5. 35 mm – Allows Direct Sensing Near GND V ( 1) For all available packages see the orderable addendum at OUT the end of the soic datasheet.
Optocoupler, Phototransistor Output, Dual Channel, SOIC- 8 package Vishay Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. com R2 ( 4- March ) Package Details SOIC- 16 Case Mechanical Drawing Mounting Pad Geometry( Dimensions in mm) Lead Code: Reference individual device datasheet. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrical isolation between input and output. The ILD217T come in a standard SOIC- 8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space.
TL431A, B Series, NCV431A, B Series, SCV431A www. com 3 THERMAL CHARACTERISTICS Characteristic Symbol D, LP Suffix Package P Suffix DM Suffix.